Aming Sungkowo, Yanuar Zulardiansyah Arief and Rosyid Ridlo Al-Hakim 2022. Analysis of Ag2+ and Cu2+ electroplating on the aluminum layer thickness level: A reanalysis. Journal of Technology Informatics and Engineering. 1, 2 (Aug. 2022), 35-42. DOI:https://doi.org/10.51903/jtie.v1i2.139.