Aming Sungkowo, Yanuar Zulardiansyah Arief, and Rosyid Ridlo Al-Hakim. 2022. “Analysis of Ag2+ and Cu2+ Electroplating on the Aluminum Layer Thickness Level: A Reanalysis”. Journal of Technology Informatics and Engineering 1 (2), 35-42. https://doi.org/10.51903/jtie.v1i2.139.