Analysis of Ag2+ and Cu2+ electroplating on the aluminum layer thickness level: A reanalysis. Journal of Technology Informatics and Engineering, [S. l.], v. 1, n. 2, p. 35–42, 2022. DOI: 10.51903/jtie.v1i2.139. Disponível em: https://jtie.stekom.ac.id/index.php/jtie/article/view/139.. Acesso em: 27 nov. 2024.