Analysis of Ag2+ and Cu2+ electroplating on the aluminum layer thickness level: A reanalysis
Keywords:
Coating, Copper, Electrical Current, Electrochemical, Silver.
Abstract
We reanalyze the effect of silver (Ag2+) and copper (Cu2+) coating solutions for the thickness of the layer on aluminum (Al) materials with increased electrical currents 0.4A, 0.8A, 1A, 1.2A, and 1.4A and increased thickness layer (10µm, 20µm, 30µm, 40µm, and 50µm), as well as the previous study was conducted. We used the electroplating method and thickness test, as well as the Brinell hardness test for both coating solutions. The results show statistically significant (p-value < 0.05, one-tailed) between high electric current and aluminum (Al) coating process with silver (Ag2+) and copper (Cu2+), as well as silver (Ag2+), get the faster coating process time. The Brinell hardness test shows a statistically significant difference (p-value < 0.05, one-tailed) between the high thickness layer and HB value (Ag-coated and Cu-coated).
References
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Wang, C. Y., Tseng, Y. T., Lin, J. C., Ciou, Y. J., & Hwang, Y. R. (2021). Effect of [Zn2+]/[Cu2+] ratio of the bath on the composition and property of Cu–Zn alloy micropillars prepared using microanode-guided electroplating. Electrochimica Acta, 375, 137969. https://doi.org/10.1016/J.ELECTACTA.2021.137969
Antonius, D., Budiarto, B., Turnip, K., Purba, D., & Ambarita, I. (2018). Pengaruh jarak antar Katoda-Anoda pada Elektroplating terhadap tebal, korosi, dan juga interphase Lapisan Nikel. Prosiding Konferensi Nasional Engineering Perhotelan IX-2018, 3–6.
Assegaff, M., & Purwanto, H. (2018). PENGARUH TEGANGAN PELAPISAN NIKEL PADA TEMBAGA DALAM PELAPISAN KHROM DEKORATIF TERHADAP KETEBALAN, KEKERASAN DAN KEKASARAN LAPISAN. Jurnal Ilmiah MOMENTUM, 13(2). https://doi.org/10.36499/JIM.V13I2.2031
Basmal, B., Bayuseno, A. P., & Nugroho, S. (2012). PENGARUH SUHU DAN WAKTU PELAPISAN TEMBAGA-NIKEL PADA BAJA KARBON RENDAH SECARA ELEKTROPLATING TERHADAP NILAI KETEBALAN DAN KEKASARAN. ROTASI, 14(2), 23–28. https://doi.org/10.14710/ROTASI.14.2.23-28
Grahame, D. C. (1947). The electrical double layer and the theory of electrocapillarity. Chemical Reviews, 41(3), 441–501. https://doi.org/10.1021/CR60130A002/ASSET/CR60130A002.FP.PNG_V03
Pereira, F. V., Gurgel, L. V., de Aquino, S. F., & Gil, L. F. (2009). Removal of Zn2+ from Electroplating Wastewater Using Modified Wood Sawdust and Sugarcane Bagasse. Journal of Environmental Engineering, 135(5), 341–350. https://doi.org/10.1061/(ASCE)0733-9372(2009)135:5(341)
Protsenko, V. S., & Danilov, F. I. (2014). Chromium electroplating from trivalent chromium baths as an environmentally friendly alternative to hazardous hexavalent chromium baths: comparative study on advantages and disadvantages. Clean Technologies and Environmental Policy, 16, 1201–1206. https://doi.org/10.1007/S10098-014-0711-1
Rasyad, A., & Budiarto, B. (2018). Analisis Pengaruh Temperatur, Waktu, dan Kuat Arus Proses Elektroplating terhadap Kekuatan Tarik, Kekuatan Tekuk dan Kekerasan pada Baja Karbon Rendah. Jurnal Rekayasa Mesin, 9(3), 173–182. https://doi.org/10.21776/UB.JRM.2018.009.03.4
Sabekti, K., Mansjur, G. S., & Diningrum, J. P. (2018). Analisis Pengaruh Kuat Arus Listrik Terhadap Ketebalan Pelapisan Perak pada Alumunium A6063 dengan Proses Electroplating. Jurnal Ilmiah Teknik Mesin, 6(1), 20–29.
Schütter, C., Pohlmann, S., & Balducci, A. (2019). Industrial Requirements of Materials for Electrical Double Layer Capacitors: Impact on Current and Future Applications. Advanced Energy Materials, 9(25), 1900334. https://doi.org/10.1002/AENM.201900334
Selly, R., Rahmah, S., Nasution, H. I., Syahputra, R. A., & Zubir, M. (2020). Electroplating Method on Copper (Cu) Substrate with Silver (Ag) Coating Applied. Indonesian Journal of Chemical Science and Technology (IJCST), 3(2), 38–41. https://doi.org/10.24114/IJCST.V3I2.19524
Setiawan, A., Laura Indrayani, N., & Herawan, B. (2019). Pengaruh Arus dan Waktu Terhadap Lapisan Zinc Plating pada Material SGD400-D dengan Menggunakan Proses Elektroplating. Jurnal Ilmiah Teknik Mesin, 7(1), 32–39. https://doi.org/10.33558/JITM.V7I1.1904
Suarsana, I. (2008). Pengaruh Waktu Pelapisan Nikel Pada Tembaga Dalam Pelapisan Khrom Dekoratif Terhadap Tingkat Kecerahan Dan Ketebalan Lapisan. Jurnal Energi Dan Manufaktur, 3(1).
Sungkowo, A., Trikolas, T., Al Hakim, R. R., Riyadi, S., Arief, Y. Z., & Jaenul, A. (2021). STUDI PERBANDINGAN UJI MATERIAL ALUMINIUM MURNI (Al) DAN PELAPISAN ALUMINIUM MURNI DENGAN PERAK (Ag) MENGGUNAKAN METODA ELEKTROPLATING. Electro Luceat, 7(2). https://doi.org/10.32531/jelekn.v7i2.381
Wang, C. Y., Tseng, Y. T., Lin, J. C., Ciou, Y. J., & Hwang, Y. R. (2021). Effect of [Zn2+]/[Cu2+] ratio of the bath on the composition and property of Cu–Zn alloy micropillars prepared using microanode-guided electroplating. Electrochimica Acta, 375, 137969. https://doi.org/10.1016/J.ELECTACTA.2021.137969
Published
2022-08-23
How to Cite
Aming Sungkowo, Yanuar Zulardiansyah Arief, & Rosyid Ridlo Al-Hakim. (2022). Analysis of Ag2+ and Cu2+ electroplating on the aluminum layer thickness level: A reanalysis. Journal of Technology Informatics and Engineering, 1(2), 35-42. https://doi.org/10.51903/jtie.v1i2.139
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Articles
